The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Jun. 07, 2017
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventors:
Kazufumi Suenaga, Hitachinaka, JP;
Setsuo Ando, Hitachi, JP;
Hisashi Tate, Hitachi, JP;
Yuju Endo, Hitachi, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/10 (2006.01); H01R 9/24 (2006.01); H01R 4/18 (2006.01); H01R 4/58 (2006.01); H01R 4/20 (2006.01); H01R 9/03 (2006.01); H01R 43/05 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
H01R 4/18 (2013.01); H01R 4/20 (2013.01); H01R 4/58 (2013.01); H01R 9/03 (2013.01); H01R 43/05 (2013.01); B82Y 30/00 (2013.01);
Abstract
A crimping terminal includes a crimping part that is compressed to a conductive part of an electric wire, and a buffer layer formed on a surface where the crimping part contacts the conductive part. The buffer layer includes a resin, a plating or a grease and a conductive microscopic particle that is mixed and dispersed therein. The microscopic particle includes a fractal structure including a fine protrusion on a surface of the microscopic particle.