The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Feb. 28, 2017
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Satyabrata Raychaudhuri, Thousand Oaks, CA (US);

Yongan Yan, Thousand Oaks, CA (US);

Leonid Grigorian, Camarillo, CA (US);

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/133 (2010.01); H01G 11/36 (2013.01); H01G 11/38 (2013.01); H01G 11/86 (2013.01); H01M 4/04 (2006.01); H01M 4/1393 (2010.01); H01M 4/62 (2006.01); H01M 4/86 (2006.01); H01M 10/0525 (2010.01); H01M 8/0234 (2016.01); H01G 11/68 (2013.01); H01M 4/66 (2006.01); H01M 4/88 (2006.01); H01M 4/90 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); H01M 8/1007 (2016.01); H01M 4/131 (2010.01); H01M 4/525 (2010.01); H01M 4/58 (2010.01); H01M 4/587 (2010.01); H01M 8/1004 (2016.01); C01B 32/05 (2017.01); C01B 32/158 (2017.01); C01B 32/168 (2017.01); C01B 32/174 (2017.01); H01G 11/28 (2013.01); H01M 4/02 (2006.01); H01M 8/1018 (2016.01);
U.S. Cl.
CPC ...
H01M 4/133 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C01B 32/05 (2017.08); C01B 32/158 (2017.08); C01B 32/168 (2017.08); C01B 32/174 (2017.08); H01G 11/36 (2013.01); H01G 11/38 (2013.01); H01G 11/68 (2013.01); H01G 11/86 (2013.01); H01M 4/0402 (2013.01); H01M 4/0404 (2013.01); H01M 4/131 (2013.01); H01M 4/1393 (2013.01); H01M 4/525 (2013.01); H01M 4/587 (2013.01); H01M 4/5825 (2013.01); H01M 4/625 (2013.01); H01M 4/661 (2013.01); H01M 4/663 (2013.01); H01M 4/8605 (2013.01); H01M 4/8807 (2013.01); H01M 4/8878 (2013.01); H01M 4/9083 (2013.01); H01M 8/0234 (2013.01); H01M 8/1004 (2013.01); H01M 8/1007 (2016.02); H01M 10/0525 (2013.01); C01B 2202/02 (2013.01); C01B 2202/22 (2013.01); H01G 11/28 (2013.01); H01M 4/0471 (2013.01); H01M 2004/027 (2013.01); H01M 2008/1095 (2013.01); H01M 2220/20 (2013.01); H01M 2220/30 (2013.01); H01M 2250/20 (2013.01); Y02E 60/122 (2013.01); Y02E 60/13 (2013.01); Y02T 90/32 (2013.01); Y10S 977/75 (2013.01); Y10S 977/842 (2013.01); Y10S 977/892 (2013.01); Y10S 977/948 (2013.01);
Abstract

Cohesive carbon assemblies are prepared by obtaining a carbon starting material in the form of powder, particles, flakes, or loose agglomerates, dispersing the carbon in a selected organic solvent by mechanical mixing and/or sonication, and substantially removing the organic solvent, typically by evaporation, whereby the cohesive assembly of carbon is formed. The method is suitable for preparing free-standing, monolithic assemblies of carbon nanotubes in the form of films, wafers, or discs, having high carbon packing density and low electrical resistivity. The method is suitable for preparing adherent cohesive carbon assemblies on substrates comprising various materials. The assemblies have various potential applications, such as electrodes or current collectors in electrochemical capacitors, fuel cells, and batteries, or as electromagnetic interference shielding materials.


Find Patent Forward Citations

Loading…