The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Jun. 19, 2017
Applicant:
Microsoft Technology Licensing, Llc, Redmond, WA (US);
Inventors:
James David Holbery, Bellevue, WA (US);
Siyuan Ma, Bothell, WA (US);
Benjamin Sullivan, Seattle, WA (US);
Assignee:
MICROSOFT TECHNOLOGY LICENSING, LLC, Redmond, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01); H05K 3/28 (2006.01); H01L 33/20 (2010.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); H01L 25/0753 (2013.01); H01L 33/0095 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01); H05K 3/284 (2013.01); H01L 33/20 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01); H05K 1/0366 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/1311 (2013.01);
Abstract
An electronic assembly comprises a flexible polymer membrane having a surface with one or more electrically conductive traces arranged on the surface, a light-emissive semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive, and a flexible cover layer arranged over the surface of the polymer membrane and the semiconductor die.