The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Mar. 26, 2018
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Sundararajan Balasekaran, Yokohama, JP;

Daisuke Kimura, Yokohama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0352 (2006.01); H01L 27/146 (2006.01); H01L 31/0304 (2006.01); H01L 31/18 (2006.01); H01L 31/109 (2006.01); H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
H01L 31/035236 (2013.01); H01L 27/14636 (2013.01); H01L 27/14649 (2013.01); H01L 27/14694 (2013.01); H01L 31/022408 (2013.01); H01L 31/0304 (2013.01); H01L 31/035281 (2013.01); H01L 31/109 (2013.01); H01L 31/184 (2013.01); H01L 31/1892 (2013.01); H01L 31/03046 (2013.01); H01L 31/1844 (2013.01);
Abstract

A light receiving device includes a substrate having a principal surface and a back surface including a light receiving surface; a metal wire disposed on the principal surface, the metal wire including a bonding portion having an opening; and photodiodes that is arranged in an array on the substrate, each of the photodiodes including an electrode connected to the bonding portion of the metal wire and a semiconductor mesa including a stacked semiconductor layer, the stacked semiconductor layer including a first semiconductor layer disposed on the substrate, an optical absorption layer including a type-II superlattice structure, and a second semiconductor layer. Each of the electrodes of the photodiodes is disposed on a side surface of the semiconductor mesa in contact with the first semiconductor layer. The first semiconductor layer faces to the light receiving surface through the opening of the bonding portion.


Find Patent Forward Citations

Loading…