The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Sep. 26, 2016
Applicant:
Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;
Inventor:
Shinsei Mizuta, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 27/153 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01);
Abstract
An LED illuminator includes an LED chip and an opaque resin member. The LED chip includes a support substrate, a semiconductor layer disposed on the obverse surface of the support substrate, an electrode formed on the reverse surface of the support substrate. The obverse surface of the support substrate has a peripheral edge portion exposed from the semiconductor layer. The opaque resin member covers at least apart of the side surface of the support substrate while exposing the peripheral edge portion of the obverse surface of the support substrate.