The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Oct. 19, 2017
Applicant:

Olympus Corporation, Hachioji-shi, Tokyo, JP;

Inventor:

Toru Kondo, Tokyo, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 27/146 (2006.01); H01L 23/60 (2006.01); H01L 23/00 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 23/60 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/48 (2013.01); H01L 27/0296 (2013.01); H01L 27/146 (2013.01); H01L 27/14634 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/06131 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/06152 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/06177 (2013.01); H01L 2224/08145 (2013.01);
Abstract

A solid-state imaging device includes a first substrate, a second substrate, an electrode portion, a first substrate connecting portion, an electrostatic protection circuit, and a second substrate connecting portion. A photoelectric conversion element is disposed on the first substrate. A part of the peripheral circuit is arranged on the second substrate. The electrode portion has a connection surface. The first substrate connecting portion electrically connects the electrode portion and the second substrate. The electrostatic protection circuit is connected to a circuit between the first substrate connecting portion and the peripheral circuit. The second substrate connecting portion electrically connects the peripheral circuit and the photoelectric conversion element. The electrostatic protection circuit is disposed at a position such that the electrostatic protection circuit does not overlap any of the first substrate connecting portion and the second substrate connecting portion.


Find Patent Forward Citations

Loading…