The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Nov. 14, 2014
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventor:
Rongwei Zhang, Richardson, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 24/70 (2013.01); B82Y 40/00 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 29/0657 (2013.01); B82Y 10/00 (2013.01); H01L 24/32 (2013.01); H01L 29/0676 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29169 (2013.01); H01L 2224/29193 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83894 (2013.01); H01L 2224/94 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/207 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/2075 (2013.01);
Abstract
An apparatus for enhancing the thermal performance of semiconductor packages effectively. The concept of this invention is to provide silicon nanowires on the backside of an integrated circuit die to directly attach the die to the substrate, thereby improving the interface between die and substrate, and thus enhancing thermal performance and enhancing reliability by improving adhesion.