The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Dec. 13, 2017
Applicant:
AU Optronics Corporation, Hsinchu, TW;
Inventors:
Jia-Hong Ye, New Taipei, TW;
Pin-Fan Wang, Hsinchu County, TW;
Assignee:
Au Optronics Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 27/32 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/03 (2013.01); H01L 27/3258 (2013.01); H01L 27/3276 (2013.01); H01L 27/124 (2013.01); H01L 27/1218 (2013.01); H01L 27/1248 (2013.01); H01L 27/1262 (2013.01); H01L 2224/02235 (2013.01); H01L 2224/02255 (2013.01); H01L 2224/03013 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/03622 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/05073 (2013.01); H01L 2227/323 (2013.01);
Abstract
An array substrate includes a device array, a bonding pad, and at least one support structure. The bonding pad is located in a bonding area and is electrically connected to the device array. A horizontal distance between the at least one support structure and the bonding pad is between 5 μm and 1000 μm.