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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10312193 B1

PDFFull Text
Date of Patent:
Jun. 04, 2019

Filed:

Aug. 12, 2016

Package comprising switches and filters

Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Shiqun Gu, San Diego, CA (US);

Chengjie Zuo, San Diego, CA (US);

Steve Fanelli, San Diego, CA (US);

Husnu Ahmet Masaracioglu, La Jolla, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:

Loza & Loza, LLP/Qualcomm

Primary Examiner:

Calvin Y Choi

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H03H 1/00 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 21/768 (2013.01); H01L 23/3107 (2013.01); H01L 23/3135 (2013.01); H01L 23/481 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/97 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H03H 1/0007 (2013.01); H01L 21/568 (2013.01); H01L 23/49811 (2013.01); H01L 2223/6661 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/19 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/19101 (2013.01); H01L 2924/30111 (2013.01); H03H 2001/0021 (2013.01);
Abstract

A package includes a redistribution portion, a first portion, and a second portion. The first portion is coupled to the redistribution portion. The first portion includes a first switch comprising a plurality of switch interconnects, and a first encapsulation layer that at least partially encapsulates the first switch. The second portion is coupled to the first portion. The second portion includes a first plurality of filters. Each filter includes a plurality of filter interconnects. The second portion also includes a second encapsulation layer that at least partially encapsulates the first plurality of filters. The first portion includes a second switch positioned next to the first switch, where the first encapsulation layer at least partially encapsulates the second switch. The second portion includes a second plurality of filters positioned next to the first plurality of filters, where the secod encapsulation layer at least partially encapsulates the second plurality of filters.

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