The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Oct. 05, 2017
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Bichoy Bahr, Richardson, TX (US);

Baher Haroun, Allen, TX (US);

Ali Kiaei, San Jose, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); B81C 1/00 (2006.01); G01C 19/56 (2012.01); H01L 23/00 (2006.01); B81B 7/02 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); B81B 7/0048 (2013.01); B81B 7/02 (2013.01); B81C 1/0023 (2013.01); G01C 19/56 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01);
Abstract

An integrated circuit package includes a first die that has a microelectromechanical system (MEMS) resonator coupled to a coil. A second die includes a coil fabricated on a top surface of the second die, and an electronic circuit with tank circuit terminals fabricated on the second die and coupled to the second coil. The second die is positioned adjacent the first die such that the first coil is operable to electromagnetically couple to the second coil.


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