The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Apr. 15, 2015
Mitsubishi Electric Corporation, Tokyo, JP;
Takanobu Kajihara, Tokyo, JP;
Katsuhiko Omae, Tokyo, JP;
Shunsuke Fushie, Tokyo, JP;
Muneaki Mukuda, Tokyo, JP;
Daisuke Nakashima, Tokyo, JP;
Masahiro Motooka, Tokyo, JP;
Hiroyuki Miyanishi, Tokyo, JP;
Yuki Nakamatsu, Tokyo, JP;
Junya Suzuki, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
In a semiconductor device, a thinly-molded portion covering a whole of a heat dissipating surface portion of a lead frame and a die pad space filled portion are integrally molded from a second mold resin, because of which adhesion between the thinly-molded portion and lead frame improves owing to the die pad space filled portion adhering to a side surface of the lead frame. Also, as the thinly-molded portion is partially thicker owing to the die pad space filled portion, strength of the thinly-molded portion increases, and a deficiency or cracking is unlikely to occur.