The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Feb. 15, 2017
Semiconductor package, assembly and module arrangements for measuring gate-to-emitter/source voltage
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Reinhold Bayerer, Reichelsheim, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 29/10 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 49/02 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 23/3114 (2013.01); H01L 23/49562 (2013.01); H01L 23/49844 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 28/20 (2013.01); H01L 2223/6627 (2013.01);
Abstract
One or more additional sense terminals are added to discrete semiconductor packages, assemblies and semiconductor modules, including power semiconductor modules, to sense accurately the voltage between the gate and emitter/source of voltage-controlled chips, inside the package, assembly or module.