The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Jan. 08, 2016
Applicant:
Hamamatsu Photonics K.k., Hamamatsu-shi, Shizuoka, JP;
Inventors:
Assignee:
HAMAMATSU PHOTONICS K.K., Hamamatsu-shi, Shizuoka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/66 (2006.01); B23K 26/70 (2014.01); B23K 26/362 (2014.01); G06T 7/00 (2017.01); H01L 21/67 (2006.01); B23K 26/00 (2014.01); B23K 26/03 (2006.01); B23K 26/402 (2014.01); B23K 26/359 (2014.01); B23K 26/364 (2014.01); B23K 26/352 (2014.01); G02B 5/20 (2006.01); B23K 101/42 (2006.01); B23K 103/10 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); B23K 26/0006 (2013.01); B23K 26/032 (2013.01); B23K 26/355 (2018.08); B23K 26/359 (2015.10); B23K 26/362 (2013.01); B23K 26/364 (2015.10); B23K 26/402 (2013.01); B23K 26/702 (2015.10); G06T 7/0008 (2013.01); H01L 21/67282 (2013.01); H01L 23/544 (2013.01); B23K 2101/42 (2018.08); B23K 2103/10 (2018.08); B23K 2103/166 (2018.08); G02B 5/208 (2013.01); G06T 2207/10048 (2013.01); G06T 2207/10152 (2013.01); G06T 2207/30148 (2013.01); G06T 2207/30204 (2013.01); H01L 2223/54426 (2013.01);
Abstract
An inspection system includes a laser light source, an optical system for laser marking that irradiates a semiconductor device with laser light from a metal layer side, a control unit that controls the laser light source to control laser marking, a two-dimensional camera that detects light from the semiconductor device on a substrate side and outputs an optical reflection image, and an analysis unit that generates a pattern image of the semiconductor device, and the control unit controls the laser light source so that laser marking is performed until a mark image appears in a pattern image.