The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Jan. 18, 2017
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Yasuhiro Kondo, Kyoto, JP;
Katsuya Matsuura, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/012 (2006.01); H01C 1/14 (2006.01); H01G 2/06 (2006.01); H01G 4/228 (2006.01); H01G 5/01 (2006.01); H01C 1/16 (2006.01); H01G 4/012 (2006.01); H01G 4/40 (2006.01); H05K 1/18 (2006.01); H01G 4/30 (2006.01); H01C 7/00 (2006.01); H01C 17/06 (2006.01); H01G 4/008 (2006.01);
U.S. Cl.
CPC ...
H01C 1/012 (2013.01); H01C 1/14 (2013.01); H01C 1/16 (2013.01); H01G 2/065 (2013.01); H01G 4/012 (2013.01); H01G 4/228 (2013.01); H01G 4/40 (2013.01); H01G 5/01 (2013.01); H05K 1/181 (2013.01); H01C 7/003 (2013.01); H01C 17/06 (2013.01); H01G 4/008 (2013.01); H01G 4/30 (2013.01);
Abstract
A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.