The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Mar. 25, 2015
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Tomohiro Takeyasu, Ibaraki, JP;

Ikuo Kawamoto, Ibaraki, JP;

Hitoshi Morita, Ibaraki, JP;

Akira Arima, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01);
Abstract

A translucent conductive film includes a film substrate, a metal wiring layer provided as a pattern, and a colored layer. The film substrate has a plurality of protrusions on a surface at a side where the metal wiring layer is provided. The metal wiring layer has a line width of greater than 5 μm but less than 8 μm, and the metal wiring layer having a thickness of greater than or equal to 0.1 μm but less than 0.5 μm. The colored layer is provided on a main surface of the metal wiring layer at a viewing side but not on a side surface of the metal wiring layer.


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