The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Jan. 08, 2014
Applicant:

Hoya Corporation, Tokyo, JP;

Inventors:

Takeyuki Yamada, Tokyo, JP;

Takahito Nishimura, Tokyo, JP;

Assignee:

HOYA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 1/60 (2012.01); C23C 14/14 (2006.01); B24B 37/04 (2012.01); G03F 1/32 (2012.01); C23C 14/00 (2006.01); G03F 1/50 (2012.01); C23C 14/06 (2006.01); G03F 1/80 (2012.01);
U.S. Cl.
CPC ...
G03F 1/60 (2013.01); B24B 37/04 (2013.01); C23C 14/0036 (2013.01); C23C 14/0641 (2013.01); C23C 14/0676 (2013.01); C23C 14/14 (2013.01); G03F 1/32 (2013.01); G03F 1/50 (2013.01); G03F 1/80 (2013.01);
Abstract

A method for manufacturing a low-defect and high-quality mask blank substrate with minimized transfer pattern defects and high mechanical strength, particularly such that the occurrence of a phenomenon where a portion of a transfer pattern and a principal surface of the substrate therebeneath are broken off together is minimized such that there is little pattern loss. The mask blank is manufactured by preparing a mask blank substrate (X) having a substrate principal surface (X) polished using a polishing solution containing abrasive grains, etching the substrate principal surface (X) using catalyst-referred etching so as to remove damaged portions from the principal surface (X), and then depositing a thin film that forms a transfer pattern on the substrate principal surface (X) of the substrate (X) by sputtering.


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