The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

May. 31, 2016
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Hideki Yasuda, Ashigarakami-gun, JP;

Ryou Matsuno, Ashigarakami-gun, JP;

Takeharu Tani, Ashigarakami-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 1/10 (2015.01); G02B 1/111 (2015.01); G02B 1/113 (2015.01); G02B 1/16 (2015.01); G02B 5/00 (2006.01); G02B 5/28 (2006.01); C03C 17/34 (2006.01);
U.S. Cl.
CPC ...
G02B 1/111 (2013.01); C03C 17/34 (2013.01); G02B 1/113 (2013.01); G02B 1/16 (2015.01); G02B 5/008 (2013.01); G02B 5/282 (2013.01); B32B 2264/105 (2013.01); B32B 2307/204 (2013.01); B32B 2307/412 (2013.01); B32B 2307/418 (2013.01); B32B 2551/00 (2013.01); C03C 2217/445 (2013.01); C03C 2217/479 (2013.01);
Abstract

An anti-reflection optical member has a laminated structure including: a transparent substrate having a first refractive index greater than that of a predetermined medium; a metal-microparticle-containing layer containing metal microparticles; and a dielectric layer having a second refractive index greater than that of the predetermined medium, in this order. At least 60% of the metal microparticles are flat particles with a diameter-to-thickness ratio of 3 or more. Principal planes of the flat metal particles are surface-oriented in the range from 0° to 30° relative to the surface of the metal-microparticle-containing layer. In the metal-microparticle-containing layer, the metal microparticles are disposed without forming a conductive path. The dielectric layer has such a thickness that light reflected at the surface of the dielectric layer of incident light entering the laminated structure from the surface is interfered and canceled by light reflected at the interface between the dielectric layer and the metal-microparticle-containing layer.


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