The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Sep. 08, 2016
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Ali Akbar Merrikh, Austin, TX (US);

Martin Saint-Laurent, Austin, TX (US);

Mohammad Ghasemazar, Long Beach, CA (US);

Rajit Chandra, Cupertino, CA (US);

Mohamed Allam, Rancho Santa Fe, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 1/20 (2006.01); G01K 1/14 (2006.01); G01K 7/01 (2006.01); G01K 7/42 (2006.01); G06F 1/20 (2006.01); G01K 15/00 (2006.01);
U.S. Cl.
CPC ...
G01K 1/20 (2013.01); G01K 1/14 (2013.01); G01K 7/01 (2013.01); G01K 7/427 (2013.01); G01K 15/005 (2013.01); G06F 1/206 (2013.01); Y02D 10/16 (2018.01);
Abstract

A temperature sensor position offset error correction power implementation include monitors (e.g., digital power monitor/meter) to measure activity on a die, and uses the activity measurements to compute real-time temperature offsets by converting activity to power, which can be used in a simplified compact thermal model. A system on chip including the die receives a temperature measurement of a region of the system on chip from a sensor. Power consumed by the region is estimated based on the measured activity, and temperature measurement of the system on chip is adjusted based on the estimated power.


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