The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Apr. 07, 2014
Applicant:

Kyoraku Co., Ltd., Kyoto, JP;

Inventors:

Kenji Iwasaki, Aichi, JP;

Teruo Tamada, Kanagawa, JP;

Assignee:

KYORAKU CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F16L 9/21 (2006.01); B60H 1/00 (2006.01); F24F 13/02 (2006.01); B29C 51/10 (2006.01); B29C 51/12 (2006.01); B60R 16/08 (2006.01); F16L 9/00 (2006.01); F24F 13/24 (2006.01); B60L 58/26 (2019.01); B29K 23/00 (2006.01); B29K 105/00 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
F16L 9/21 (2013.01); B29C 51/105 (2013.01); B29C 51/12 (2013.01); B60H 1/00564 (2013.01); B60L 58/26 (2019.02); B60R 16/08 (2013.01); F16L 9/003 (2013.01); F24F 13/0245 (2013.01); F24F 13/24 (2013.01); B29K 2023/12 (2013.01); B29K 2105/256 (2013.01); B29K 2995/0002 (2013.01); B29L 2031/3032 (2013.01); B60H 2001/006 (2013.01); F24F 2013/242 (2013.01);
Abstract

Provided is a duct that does not cause defective molding and has a highly sound absorption inner surface which can effectively suppress noise. A duct includes a tubular duct main body and a sound absorption member disposed on the inner surface of the duct main body. The duct has at least one of configurations (1) to (3): (1) the duct main body has a sandwiching part having a pair of opposite wall surfaces, and a side edge of the sound absorption member is sandwiched between the wall surfaces of the sandwiching part; (2) the sound absorption member is pasted to the inner surface of the duct main body with a resin film therebetween; and (3) the sound absorption member and duct main body have parts which are not fused to each other.


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