The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Nov. 11, 2015
Applicant:
Beijing Naura Microelectronics Equipment Co., Ltd., Beijing, CN;
Inventor:
Yujie Yang, Beijing, CN;
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C23C 14/35 (2006.01); H01J 37/34 (2006.01); C23C 14/06 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
C23C 14/35 (2013.01); C23C 14/0641 (2013.01); C23C 14/3414 (2013.01); H01J 37/3405 (2013.01); H01J 37/347 (2013.01); H01J 37/3408 (2013.01); H01J 37/3429 (2013.01); H01J 37/3452 (2013.01); H01L 21/2855 (2013.01);
Abstract
Some embodiments of the present disclosure provide a sputtering apparatus including a magnetron structure configured to erode a target according to a predetermined erosion rate profile symmetric to a central axis of the magnetron structure. The predetermined erosion rate profile includes a first peak rate in proximity to the central axis; and a second peak rate located at about from 0.7 to 0.75 of a radius of the target from the central axis.