The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Nov. 09, 2015
Applicant:

Hyundai Motor Company, Seoul, KR;

Inventors:

Moon Ki Bae, Gyeonggi-do, KR;

Seung Hyun Hong, Seoul, KR;

Sung Chul Cha, Seoul, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C21D 9/46 (2006.01); C21D 8/02 (2006.01); C22C 38/32 (2006.01); C22C 38/22 (2006.01); C22C 38/28 (2006.01); C22C 38/26 (2006.01); C22C 38/04 (2006.01); C22C 38/02 (2006.01); C23C 2/06 (2006.01); C23C 2/28 (2006.01); B32B 15/01 (2006.01); C23C 2/04 (2006.01); C23C 28/02 (2006.01); C23C 28/00 (2006.01); C23C 2/40 (2006.01); C23C 30/00 (2006.01); B32B 15/18 (2006.01); C22C 38/50 (2006.01); B32B 15/04 (2006.01); C22C 38/12 (2006.01); C22C 38/14 (2006.01); C22C 38/48 (2006.01); C22C 38/44 (2006.01); C23C 2/26 (2006.01);
U.S. Cl.
CPC ...
C21D 9/46 (2013.01); B32B 15/013 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C21D 8/0205 (2013.01); C21D 8/0221 (2013.01); C21D 8/0273 (2013.01); C21D 8/0278 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/22 (2013.01); C22C 38/26 (2013.01); C22C 38/28 (2013.01); C22C 38/32 (2013.01); C22C 38/44 (2013.01); C22C 38/48 (2013.01); C22C 38/50 (2013.01); C23C 2/04 (2013.01); C23C 2/06 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/285 (2013.01); C23C 2/40 (2013.01); C23C 28/02 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 28/025 (2013.01); C23C 28/3225 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); Y10T 428/12792 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12965 (2015.01); Y10T 428/12972 (2015.01);
Abstract

Disclosed is a steel composition for hot stamping that comprises carbon (C) in an amount of about 0.22 to about 0.25 wt %, silicon (Si) in an amount of about 0.2 to about 0.3 wt %, manganese (Mn) in an amount of about 1.2 to about 1.4 wt %, titanium (Ti) in an amount of about 0.02 to about 0.05 wt %, chromium (Cr) in an amount of about 0.11 to about 0.2 wt %, boron (B) in an amount of about 0.005 to about 0.01 wt %, zinc (Zr) in an amount of about 0.005 to about 0.02 wt %, niobium (Nb) in an amount of about 0.01 to about 0.05 wt %, tungsten (W) in an amount of about 0.1 to about 0.5 wt %, iron (Fe) constituting the remaining balance of the steel composition, all the wt % based on the total amount of the steel composition.


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