The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Mar. 14, 2014
Applicant:

The Research Foundation for the State University of New York, Binghamton, NY (US);

Inventors:

Hao Wang, Potomac, MD (US);

Bahgat Sammakia, Binghamton, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/16 (2006.01); C09K 5/14 (2006.01); B23K 1/00 (2006.01); B23K 35/36 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B23K 1/0016 (2013.01); B23K 35/36 (2013.01); B23K 2001/12 (2013.01); H01B 1/02 (2013.01);
Abstract

A class of paste materials for thermal, and mechanical bonding, and in some cases electrical interconnection, of two solid surfaces includes particles and an organic vehicle which is partially or completely removed during processing. The paste includes hybrids of inorganic materials for meeting the thermal, electrical and mechanical bonding functionality requirements and organic materials for meeting the process, application and protection requirements. The inorganic materials include high thermal and optionally electrical conductivity materials in forms from nanoparticles to micro-powders. The organic materials may include small molecules, surfactant, oligomers, and polymers.


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