The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Apr. 23, 2012
Applicants:
Masatsugu Higashi, Osaka, JP;
Akiko Tanaka, Osaka, JP;
Aimi Matsuura, Osaka, JP;
Kiyoe Shigetomi, Osaka, JP;
Tetsuo Inoue, Osaka, JP;
Inventors:
Masatsugu Higashi, Osaka, JP;
Akiko Tanaka, Osaka, JP;
Aimi Matsuura, Osaka, JP;
Kiyoe Shigetomi, Osaka, JP;
Tetsuo Inoue, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 135/02 (2006.01); C09J 133/08 (2006.01); C09J 133/10 (2006.01); C09J 7/38 (2018.01); C09J 7/22 (2018.01); G02B 5/30 (2006.01); C08K 5/103 (2006.01); C08F 220/18 (2006.01); C08F 220/26 (2006.01); C09J 133/06 (2006.01); C09J 4/06 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C09J 135/02 (2013.01); C09J 4/06 (2013.01); C09J 7/22 (2018.01); C09J 7/385 (2018.01); C09J 133/066 (2013.01); C09J 133/08 (2013.01); C09J 133/10 (2013.01); C08F 220/26 (2013.01); C08F 2220/1891 (2013.01); C08K 5/0025 (2013.01); C08K 5/103 (2013.01); C09J 2201/606 (2013.01); C09J 2201/622 (2013.01); C09J 2203/318 (2013.01); C09J 2205/10 (2013.01); C09J 2400/00 (2013.01); C09J 2433/00 (2013.01); G02B 5/30 (2013.01); Y10T 428/2891 (2015.01);
Abstract
A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 19 to 99.5% by weight of an alkyl (meth)acrylate having a branched alkyl group of 10 to 24 carbon atoms at an ester end. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant.