The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Dec. 17, 2015
Applicants:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;

Inventors:

Toshio Shiobara, Tokyo, JP;

Junichi Sawada, Gunma, JP;

Miyuki Wakao, Gunma, JP;

Tsutomu Kashiwagi, Gunma, JP;

Naofusa Miyagawa, Tokyo, JP;

Yoshihiro Kawada, Tokyo, JP;

Chie Sasaki, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08L 83/06 (2006.01); C08G 59/32 (2006.01); C08G 59/42 (2006.01); H01L 23/29 (2006.01); G02B 1/04 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/3281 (2013.01); C08G 59/42 (2013.01); C08G 59/4215 (2013.01); G02B 1/04 (2013.01); H01L 23/296 (2013.01); C08L 2205/025 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. The epoxy resin composition comprises the following components (A) to (C):


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