The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Sep. 02, 2016
Applicant:

Evonik Technochemie Gmbh, Dossenheim, DE;

Inventors:

Sergey Evsyukov, Ludwigshafen, DE;

Tim Pohlmann, Nidderau, DE;

Horst Stenzenberger, Heidelberg, DE;

Matthijs Ter Wiel, Dossenheim, DE;

Assignee:

Evonik Technochemie GmbH, Dossenheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 4/00 (2006.01); C07C 43/21 (2006.01); C07C 43/23 (2006.01); C07C 49/84 (2006.01); C08G 63/13 (2006.01); C08G 65/34 (2006.01); C08G 65/40 (2006.01); C08G 65/48 (2006.01); C08G 75/23 (2006.01); C08L 71/00 (2006.01); C08L 79/08 (2006.01); C07C 317/22 (2006.01); C07D 239/52 (2006.01); C08F 222/40 (2006.01);
U.S. Cl.
CPC ...
C08G 75/23 (2013.01); C07C 43/21 (2013.01); C07C 43/23 (2013.01); C07C 49/84 (2013.01); C07C 317/22 (2013.01); C07D 239/52 (2013.01); C08F 222/40 (2013.01); C08G 63/13 (2013.01); C08G 65/34 (2013.01); C08G 65/4012 (2013.01); C08G 65/48 (2013.01); C08L 71/00 (2013.01); C09J 4/00 (2013.01);
Abstract

A compound according to formula (I) can be part of a heat-curable resin composition based on polymaleimide resin systems comprising such compound as co-monomer: wherein D is an x-functional group; and x is an integer ≥2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. A crosslinked resin is obtainable by curing such composition. The compounds can be used in structural adhesives, matrix resins for fiber prepregs, moulding compounds, and structural and/or electrical composites.


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