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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10308758 B1

PDFFull Text
Date of Patent:
Jun. 04, 2019

Filed:

Sep. 25, 2014

Filling material for three-dimensional mounting of semiconductor element

Applicant:

Daicel Corporation, Osaka-shi, Osaka, JP;

Inventors:

Hiroki Tanaka, Himeji, JP;

Katsuhiro Nakaguchi, Himeji, JP;

Assignee:

DAICEL CORPORATION, Osaka-shi, Osaka, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

David T Karst

Int. Cl.
CPC ...
C08G 59/24 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); C08G 59/22 (2006.01); C08G 59/40 (2006.01); C08K 3/36 (2006.01); C08K 5/5425 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
C08G 59/245 (2013.01); C08G 59/226 (2013.01); C08G 59/24 (2013.01); C08G 59/4064 (2013.01); C08G 59/687 (2013.01); C08K 3/36 (2013.01); C08K 5/5425 (2013.01); C08L 63/00 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/295 (2013.01); H01L 23/3142 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/96 (2013.01); H01L 25/0657 (2013.01); H01L 21/568 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92244 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2924/18162 (2013.01);
Abstract

Provided are a filling component useful for the production of a thin, low-profile three-dimensional integrated semiconductor device via a COW process, and a curable composition for the formation of the filling component. The filling component according to the present invention for three-dimensional mounting of semiconductor elements is used to fill gaps between laterally adjacent semiconductor elements in the production of a three-dimensional integrated semiconductor device by stacking and integrating semiconductor elements. The filling component is a component that is polished and/or ground flat from the front side of semiconductor elements while gaps between the semiconductor elements are filled with the filling component.

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