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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10308732 B1

PDFFull Text
Date of Patent:
Jun. 04, 2019

Filed:

Jul. 21, 2015

Package for pellets of saponified ethylene-vinyl ester-based copolymer or resin composition thereof

Applicant:

The Nippon Synthetic Chemical Industry Co., Ltd., Osaka, JP;

Inventor:

Ikko Matsui, Osaka, JP;

Assignee:

THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD., Osaka, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Mark S Kaucher

Int. Cl.
CPC ...
C08F 6/28 (2006.01); B65D 65/38 (2006.01); B65D 85/00 (2006.01); C08J 3/12 (2006.01); B32B 27/32 (2006.01); B65D 65/40 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 15/082 (2006.01); B32B 15/085 (2006.01); B32B 15/088 (2006.01); B32B 15/09 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/10 (2006.01); B32B 27/12 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 29/00 (2006.01);
U.S. Cl.
CPC ...
C08F 6/28 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); B32B 15/082 (2013.01); B32B 15/085 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/12 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 29/002 (2013.01); B32B 29/005 (2013.01); B65D 65/38 (2013.01); B65D 65/40 (2013.01); B65D 85/70 (2013.01); C08J 3/12 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2250/04 (2013.01); B32B 2250/05 (2013.01); B32B 2255/02 (2013.01); B32B 2255/10 (2013.01); B32B 2255/12 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2307/20 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2307/31 (2013.01); B32B 2307/7246 (2013.01); B32B 2307/732 (2013.01); B32B 2307/744 (2013.01); B32B 2439/00 (2013.01); B32B 2439/46 (2013.01); B32B 2439/62 (2013.01); B32B 2553/00 (2013.01); B65D 2213/02 (2013.01); C08J 2329/04 (2013.01);
Abstract

The purpose of the invention is to provide: a package for EVOH resin pellets which is capable of providing the EVOH resin pellets almost free from powder even in a case where the package contains the powder generated therein during transportation or the like after shipment; and EVOH resin pellets contaminated with very small amount of the powder in a case where a user uses the EVOH resin pellets as a molding material. A package, where pellets each having a substantially circular or oval cross-section are packed in a packaging container whose inner surface has a surface resistivity of 1.0×10Ω or more, is capable of providing pellets to which 0.8 wt % or less of powder adhered relative to the weight of the pellets.

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