The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Jun. 22, 2016
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Frédéric Atkins-Barratt, Vaux le Penil, FR;

Jean-Luc Dabouineau, Nemours, FR;

Jean-Pierre Henri René Lereboullet, Bois le Roi, FR;

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 23/027 (2006.01); C03B 23/037 (2006.01); C03B 23/035 (2006.01); B29C 51/26 (2006.01); B29C 51/10 (2006.01);
U.S. Cl.
CPC ...
C03B 23/037 (2013.01); B29C 51/262 (2013.01); C03B 23/0352 (2013.01); B29C 51/10 (2013.01); B29C 2791/006 (2013.01); B29C 2791/007 (2013.01);
Abstract

A mold has a sealing surface bearing a sealing profile. A plenum has a sealing surface bearing a sealing profile. The mold and plenum together form an apparatus for reforming a sheet material. In the closed position of the apparatus, the sealing profile of the mold is in opposing relation to the sealing profile of the plenum and the sealing profiles of the mold and plenum together define a profiled sealing gap. When the sheet material is wedged into the profiled sealing gap, a direct seal will be formed between the sheet material and each of the mold and plenum, resulting in two forming areas within the apparatus.


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