The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10308001 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 04, 2019

Filed:

Jun. 24, 2016
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Messaoud Bedjaoui, Voreppe, FR;

Pierre Garrec, Saint Martin D'Uriage, FR;

Sylvain Nizou, Poce sur Cisse, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/38 (2006.01); H01M 2/02 (2006.01); H01M 6/02 (2006.01); H01M 6/40 (2006.01); B32B 37/12 (2006.01); G02F 1/153 (2006.01); H01G 11/10 (2013.01); H01G 11/78 (2013.01); H01G 11/84 (2013.01); H01L 51/00 (2006.01); G02F 1/1333 (2006.01); H01L 21/683 (2006.01); H01M 10/052 (2010.01); H01M 10/0585 (2010.01);
U.S. Cl.
CPC ...
B32B 37/12 (2013.01); G02F 1/1333 (2013.01); G02F 1/153 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01); H01G 11/10 (2013.01); H01G 11/78 (2013.01); H01G 11/84 (2013.01); H01L 51/003 (2013.01); H01M 2/0207 (2013.01); H01M 6/02 (2013.01); H01M 6/40 (2013.01); H01M 10/052 (2013.01); H01M 10/0585 (2013.01); B32B 2457/10 (2013.01); H01L 21/6835 (2013.01); H01L 2221/6835 (2013.01); Y02E 60/13 (2013.01);
Abstract

A method for manufacturing an electronic device including a substrate, including assembling the substrate, by a joining zone of a first face of the substrate, with a joining zone of a first face of a carrier, and disjoining the substrate relatively to the carrier. After the step of assembling, the method includes formation of a film on the substrate, the film being configured to adhere to an adhesion zone of a second face of the substrate opposite the first face of the substrate, the adhesive force between the film and the adhesion zone of the second face of the substrate being chosen greater than the joining force between the joining zone of the carrier and the joining zone of the first face of the substrate. A traction on the film has a force of traction configured to overcome the joining force without overcoming the adhesive force.


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