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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10307990 B1

PDFFull Text
Date of Patent:
Jun. 04, 2019

Filed:

Feb. 02, 2010

Epoxy resin composition, prepreg, resin-coated metal foil, resin sheet, laminate and multilayer board

Applicants:

Hidetaka Kakiuchi, Sukagawa, JP;

Yoshihiko Nakamura, Sukagawa, JP;

Shunji Araki, Koriyama, JP;

Yuki Miyoshi, Koriyama, JP;

Inventors:

Hidetaka Kakiuchi, Sukagawa, JP;

Yoshihiko Nakamura, Sukagawa, JP;

Shunji Araki, Koriyama, JP;

Yuki Miyoshi, Koriyama, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Coris Fung

Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 15/092 (2006.01); C08G 59/40 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); B32B 15/14 (2006.01); C08G 59/14 (2006.01); C08L 63/00 (2006.01); B32B 7/12 (2006.01); B32B 27/10 (2006.01); B32B 27/12 (2006.01); B32B 27/28 (2006.01); B32B 27/36 (2006.01); B32B 29/00 (2006.01); C08K 5/49 (2006.01);
U.S. Cl.
CPC ...
B32B 15/092 (2013.01); B32B 7/12 (2013.01); B32B 15/14 (2013.01); B32B 27/10 (2013.01); B32B 27/12 (2013.01); B32B 27/281 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 29/002 (2013.01); C08G 59/1488 (2013.01); C08G 59/4021 (2013.01); C08G 59/62 (2013.01); C08G 59/686 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); H05K 1/0326 (2013.01); B32B 2255/06 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/02 (2013.01); B32B 2262/101 (2013.01); B32B 2307/204 (2013.01); B32B 2307/306 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08K 5/49 (2013.01); H05K 2201/012 (2013.01); Y10T 428/31529 (2015.04);
Abstract

An epoxy resin composition contains a polyfunctional epoxy resin (A), a polyphenylene ether compound (B) and a phosphorus-modified curing agent (C). A polyphenylene ether (B1) having a number-average molecular weight of 500 to 3000 and an average of 1.0 to 3.0 hydroxyl groups per molecule, and an epoxy resin (B2) obtained by reacting this polyphenylene ether (B1) with an epoxy resin (D) having an average of 2.3 or fewer epoxy groups per molecule and the like, are included as the polyphenylene ether compound (B). A phosphorus-modified epoxy resin (P) is included in at least one selected from the polyfunctional epoxy resin (A), the epoxy resin (D) and a component other than the (A), (B) and (C) above. The phosphorus content is 1.5 to 4.5 mass % as a percentage of the resin solids in the epoxy resin composition.

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