The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Aug. 31, 2017
Applicant:
Isola Usa Corp., Chandler, AZ (US);
Inventor:
Roland Schönholz, Schopfheim, DE;
Assignee:
Isola USA Corp., Chandler, AZ (US);
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/06 (2006.01); B32B 15/08 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 37/00 (2006.01); B32B 37/02 (2006.01); B32B 37/26 (2006.01); H05K 3/46 (2006.01); B32B 38/10 (2006.01); H05K 1/02 (2006.01); B32B 37/14 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); B32B 37/30 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 37/0076 (2013.01); B32B 37/02 (2013.01); B32B 37/26 (2013.01); H05K 3/4691 (2013.01); B32B 37/144 (2013.01); B32B 37/30 (2013.01); B32B 38/10 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2305/076 (2013.01); B32B 2305/72 (2013.01); B32B 2305/74 (2013.01); B32B 2305/77 (2013.01); B32B 2307/41 (2013.01); B32B 2307/412 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/08 (2013.01); H05K 1/028 (2013.01); H05K 1/0278 (2013.01); H05K 1/118 (2013.01); H05K 1/147 (2013.01); H05K 3/429 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/095 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09081 (2013.01); Y10T 428/2486 (2015.01); Y10T 428/24314 (2015.01); Y10T 428/24322 (2015.01); Y10T 428/24331 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/24802 (2015.01); Y10T 428/24851 (2015.01);
Abstract
Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.