The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Dec. 27, 2013
Hitachi Chemical Company, Ltd., Tokyo, JP;
Masaya Ozawa, Tokyo, JP;
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Abstract
Provided herein is an apparatus of manufacturing a molding material that can significantly reduce the frequency of replacement of a bottom member without increasing the drainage time longer. A bottom member () is constituted of two layers of wire meshes including an annular dutch-woven wire mesh (A) made of stainless steel and an annular plain-woven wire mesh made of stainless steel. The two layers of wire meshes are secured to each other by sintering. A support plate () made of stainless steel is disposed between the bottom member () and a lower hollow compression mold (). The support plate () has a plurality of through holes () formed therein, and is configured to support the bottom member ().