The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
May. 17, 2016
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Kyosuke Toda, Kawasaki, JP;
Yukuo Yamaguchi, Tokyo, JP;
Mikiya Umeyama, Tokyo, JP;
Satoshi Oikawa, Yokohama, JP;
Hiromasa Amma, Kawasaki, JP;
Takuya Iwano, Inagi, JP;
Satoshi Kimura, Kawasaki, JP;
Naoko Tsujiuchi, Kawasaki, JP;
Yasushi Iijima, Tokyo, JP;
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B 7/22 (2006.01); B29C 65/70 (2006.01); B29C 45/00 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01); B41J 2/175 (2006.01); B29L 31/00 (2006.01); B29C 45/16 (2006.01);
U.S. Cl.
CPC ...
B29C 65/70 (2013.01); B29C 45/0062 (2013.01); B41J 2/14 (2013.01); B41J 2/16 (2013.01); B41J 2/1752 (2013.01); B41J 2/1753 (2013.01); B29C 45/1615 (2013.01); B29C 2045/0063 (2013.01); B29C 2045/1623 (2013.01); B29C 2045/1637 (2013.01); B29L 2031/767 (2013.01);
Abstract
Provided is construction that in die slide injection molding, surely leaves each part in a mold on a specified side in the stage of opening a molding mold. In order to accomplish this, in an opening step, a push-out mechanism that applies a force on at least one of the individual parts is used to make the part surely belong to a desired mold.