The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Jul. 25, 2018
Fukui Prefectural Government, Fukui, Fukui, JP;
Matsuura Machinery Corporation, Fukui, Fukui, JP;
Fukui Prefectural Government, Fukui, Fukui, JP;
Matsuura Machinery Corporation, Fukui, Fukui, JP;
Abstract
A three-dimensional molding method in which a step of sintering a powder layer with a laser light or an electron beam after a flat surface has been formed by sliding of a squeegee against the powder layer is repeated in a prescribed number of times, and then the periphery is cut, in order to mold both the objectto be molded and a support structurethat supports the lower side of the objectfrom below and is intended to be removed after molding, wherein in the support structure, the upper parts of the struts connected to the objectto be molded employ truncated circular conic shapes or partial truncated circular conic shapes that are reduced in diameter toward the top.