The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Jan. 17, 2016
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Masakazu Hiraishi, Kyoto, JP;

Takashi Nakagawa, Osaka, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 45/78 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14688 (2013.01); B29C 45/14836 (2013.01); B29C 45/78 (2013.01); B29C 2045/14877 (2013.01); B29C 2945/7604 (2013.01); B29C 2945/76254 (2013.01); B29C 2945/76347 (2013.01); B29C 2945/76545 (2013.01); B29C 2945/76802 (2013.01); B29C 2945/76826 (2013.01); B29L 2031/722 (2013.01);
Abstract

A warm-air blowing circuit and another warm-air blowing circuit are disposed so as to heat a film from both sides of a projection side and a recess side of a die, warm air reaches and heats the film from the time of supplying of the film, warm air continues to enter a space in which a resin is to be ejected even after the die is closed, and thereby the film is likely to extend. Therefore, the film is unlikely to be torn at the time of molding when the film is likely to be shaped after a shape of the die and it is possible to prevent broken pieces of the film or broken pieces of a decoration film from being mixed and being stuck to the surface of the die such that it is possible to improve quality of the external appearance of a molded product.


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