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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10307937 B1

PDFFull Text
Date of Patent:
Jun. 04, 2019

Filed:

Dec. 04, 2013

Hot stamping method

Applicant:

Sartorius Stedim Biotech Gmbh, Goettingen, DE;

Inventors:

Thomas Regen, Goettingen, DE;

Sebastian Purmann, Goettingen, DE;

Nikoloudis Paschalis, Goettingen, DE;

Christian Grimm, Heilbad, DE;

Assignee:

Sartorius Stedim Biotech GmbH, , DE;

Attorneys:

Gerald E. Hespos

Michael J. Porco

Matthew T. Hespos

Primary Examiner:

Philip C Tucker

Assistant Examiner:

Brian R Slawski

Int. Cl.
CPC ...
B29C 65/00 (2006.01); B29C 65/02 (2006.01); B32B 37/00 (2006.01); B32B 38/00 (2006.01); B32B 38/10 (2006.01); B29C 51/16 (2006.01); B32B 38/04 (2006.01); C08J 5/00 (2006.01); G01F 1/66 (2006.01); B28B 5/00 (2006.01); B29C 47/00 (2006.01); B29B 13/02 (2006.01); G01F 15/00 (2006.01); G01F 15/14 (2006.01); B29D 23/00 (2006.01); B29C 45/00 (2006.01); G01F 15/18 (2006.01); B29C 65/08 (2006.01); B29C 65/16 (2006.01); B29C 65/20 (2006.01); B29K 101/12 (2006.01); B29L 9/00 (2006.01); B29L 23/00 (2006.01);
U.S. Cl.
CPC ...
B29B 13/024 (2013.01); B29C 45/0055 (2013.01); B29C 65/02 (2013.01); B29D 23/001 (2013.01); G01F 1/662 (2013.01); G01F 15/006 (2013.01); G01F 15/14 (2013.01); G01F 15/185 (2013.01); B29C 65/08 (2013.01); B29C 65/16 (2013.01); B29C 65/20 (2013.01); B29C 66/5221 (2013.01); B29C 66/52298 (2013.01); B29C 66/543 (2013.01); B29K 2101/12 (2013.01); B29L 2009/00 (2013.01); B29L 2023/00 (2013.01);
Abstract

A method for implementing a channel () includes providing a preform () having a recess () therein and heating a channel implementation element (') to a temperature greater than a melting temperature of a material of the preform (). An external contour of the channel implementation element (′) at least regionally corresponds to an internal contour of the channel () to be implemented. The method then moves the heated channel implementation and/or the preform () in relation to one another so that the heated channel implementation element () at least regionally moves into the recess () in a moving-in direction. The material of the preform () is at least partially melted in a region around the recess () and is at least partially displaced by the channel implementation element (′), wherein at least a part of the channel () to be implemented is thus implemented.

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