The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Jan. 11, 2018
Applicant:
Furukawa Electric Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/351 (2014.01); B23K 26/352 (2014.01); C09J 201/00 (2006.01); C09J 7/20 (2018.01); H01L 21/304 (2006.01); B23K 26/362 (2014.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
B23K 26/351 (2015.10); B23K 26/362 (2013.01); C09J 7/20 (2018.01); C09J 201/00 (2013.01); H01L 21/304 (2013.01); H01L 21/3081 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract
A method of producing a semiconductor chip, including the following steps (a) to (d):