The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Dec. 30, 2015
Applicant:

Cooler Master Corp., New Taipei, TW;

Inventor:

Ralph Remsburg, Midland, TX (US);

Assignee:

COOLER MASTER CORP., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 39/00 (2006.01); B23K 20/233 (2006.01); B32B 15/01 (2006.01); B23K 20/02 (2006.01); B23K 20/00 (2006.01); B23K 20/24 (2006.01); B32B 3/26 (2006.01); C22C 9/00 (2006.01); B23K 35/28 (2006.01); B23K 35/30 (2006.01); B23K 35/02 (2006.01); B23K 26/361 (2014.01); B23K 26/382 (2014.01); B23K 26/352 (2014.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01); B23K 103/18 (2006.01);
U.S. Cl.
CPC ...
B23K 20/2333 (2013.01); B23K 20/002 (2013.01); B23K 20/021 (2013.01); B23K 20/023 (2013.01); B23K 20/24 (2013.01); B23K 26/355 (2018.08); B23K 26/361 (2015.10); B23K 26/389 (2015.10); B23K 35/0255 (2013.01); B23K 35/286 (2013.01); B23K 35/302 (2013.01); B32B 3/266 (2013.01); B32B 15/01 (2013.01); B32B 15/017 (2013.01); C22C 9/00 (2013.01); B23K 2103/10 (2018.08); B23K 2103/12 (2018.08); B23K 2103/18 (2018.08);
Abstract

A bonded dissimilar material structure includes a first component made of a first dissimilar material; a second component made of a second dissimilar material stacked under the first component; and a plurality of blind holes formed on an upper surface of the second component; and the first component has a plurality of protrusions formed in the plurality of blind holes on the second component, respectively.


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