The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Jul. 01, 2016
Applicant:

Centrillion Technology Holdings Corporation, Grand Cayman, Cayman Islands, KY;

Inventors:

Filip Crnogorac, Redwood City, CA (US);

Glenn McGall, Palo Alto, CA (US);

Bolan Li, Mountain View, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/12 (2006.01); B01J 19/00 (2006.01); G03F 7/16 (2006.01); B05C 11/02 (2006.01); B05C 11/08 (2006.01); B05C 11/10 (2006.01); B05C 13/00 (2006.01); B05D 1/00 (2006.01); G03F 7/30 (2006.01); C40B 50/18 (2006.01); C40B 60/14 (2006.01);
U.S. Cl.
CPC ...
B01J 19/0046 (2013.01); B05C 11/023 (2013.01); B05C 11/08 (2013.01); B05C 11/1039 (2013.01); B05C 13/00 (2013.01); B05D 1/005 (2013.01); G03F 7/162 (2013.01); G03F 7/30 (2013.01); G03F 7/3014 (2013.01); B01J 2219/0036 (2013.01); B01J 2219/00333 (2013.01); B01J 2219/00421 (2013.01); B01J 2219/00443 (2013.01); B01J 2219/00529 (2013.01); B01J 2219/00536 (2013.01); B01J 2219/00596 (2013.01); B01J 2219/00608 (2013.01); B01J 2219/00612 (2013.01); B01J 2219/00659 (2013.01); B01J 2219/00675 (2013.01); B01J 2219/00691 (2013.01); B01J 2219/00722 (2013.01); C40B 50/18 (2013.01); C40B 60/14 (2013.01);
Abstract

The present disclosure provides methods, device, and system for wafer processing. The wafer processing apparatus uses lid dispenser to disperse at least one reagent to the surface of the wafer. Further, the wafer is positioned on top of a rotatable vacuum chuck configured to spread at least one reagent over the surface of the wafer via a centrifugal force or surface tension, thereby permitting the at least one reagent to react with an additional reagent. Further, when dispensing the at least one reagent, a separation gap between the lid dispenser and the wafer is at a predetermined distance, for example, from 50 μm to 2 mm.


Find Patent Forward Citations

Loading…