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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10307300 B1

PDFFull Text
Date of Patent:
Jun. 04, 2019

Filed:

Dec. 09, 2016

Apparatus and methods for transferring and bonding substrates

Applicant:

The Procter & Gamble Company, Cincinnati, OH (US);

Inventors:

Eric Shawn Goudy, Liberty Township, OH (US);

Jason Lee DeBruler, West Chester, OH (US);

Michael Devin Long, Springfield Township, OH (US);

Assignee:

The Procter & Gamble Company, Cincinnati, OH (US);

Attorneys:

Andrew J. Hagerty

Charles R. Matson

Sarah M. DeCristofaro

Primary Examiner:

Carson Gross

Int. Cl.
CPC ...
A61F 13/15 (2006.01); B29C 65/00 (2006.01); B29C 65/02 (2006.01); B29C 65/10 (2006.01); B29C 65/48 (2006.01); B29L 31/48 (2006.01);
U.S. Cl.
CPC ...
A61F 13/15739 (2013.01); B29C 65/02 (2013.01); B29C 65/48 (2013.01); B29C 66/00 (2013.01); B29C 66/7294 (2013.01); A61F 2013/15829 (2013.01); A61F 2013/15878 (2013.01); B29C 65/10 (2013.01); B29C 66/83411 (2013.01); B29C 66/83511 (2013.01); B29L 2031/4871 (2013.01); B32B 2555/02 (2013.01); Y10T 156/1054 (2015.01);
Abstract

A substrate assembly is mechanically deformed to form various products. In part, the substrate assembly may advance toward a bonder apparatus. The bonder apparatus rotates about a longitudinal axis and includes a plurality of manifolds. The plurality of manifolds allow for substrate assemblies including different process product pitches to be processed on a single bonder apparatus.

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Quick Actions:

Goudy, Eric. (2019). Apparatus and methods for transferring and bonding substrates (U.S. Patent No. 10307300). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10307300

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