The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Oct. 20, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 9/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 23/552 (2006.01); H05K 3/40 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0024 (2013.01); H01L 23/552 (2013.01); H05K 1/111 (2013.01); H05K 1/117 (2013.01); H05K 1/181 (2013.01); H05K 9/0039 (2013.01); H05K 3/284 (2013.01); H05K 3/321 (2013.01); H05K 3/4007 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01); H05K 2203/163 (2013.01);
Abstract
An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.