The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
May. 26, 2015
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Atsuhiro Abe, Kanagawa, JP;
Fujio Kobayashi, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 1/02 (2006.01); B32B 3/30 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B32B 27/08 (2006.01); B44C 1/24 (2006.01); H01Q 1/12 (2006.01); H04B 1/38 (2015.01); H04B 1/3888 (2015.01); H05K 5/02 (2006.01); B29C 45/14 (2006.01); B44C 1/17 (2006.01); H04M 1/02 (2006.01); B32B 27/30 (2006.01); B29K 55/02 (2006.01); B29K 69/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0243 (2013.01); B29C 45/1418 (2013.01); B29C 45/14688 (2013.01); B29C 45/14827 (2013.01); B32B 1/02 (2013.01); B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 27/08 (2013.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B44C 1/1712 (2013.01); B44C 1/24 (2013.01); H01Q 1/12 (2013.01); H04B 1/38 (2013.01); H04B 1/3888 (2013.01); H04M 1/0202 (2013.01); H04M 1/0283 (2013.01); B29K 2055/02 (2013.01); B29K 2069/00 (2013.01); B29L 2031/7162 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2270/00 (2013.01); B32B 2307/20 (2013.01); B32B 2307/412 (2013.01); B32B 2307/416 (2013.01); B32B 2451/00 (2013.01); B32B 2457/00 (2013.01);
Abstract
A casing component according to an embodiment of the present technology includes a to-be-decorated area and a decoration portion. The to-be-decorated area includes a plurality of to-be-decorated surfaces to be decorated, the plurality of to-be-decorated surfaces being formed such that adjacent to-be-decorated surfaces have different heights. The decoration portion includes a metal layer formed in each of the plurality of to-be-decorated surfaces.