The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Feb. 11, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jae-Ean Lee, Busan-si, KR;
Jee-Soo Mok, Yongin-si, KR;
Young-Gwan Ko, Seoul, KR;
Soon-Oh Jung, Yongin-si, KR;
Kyung-Hwan Ko, Gimhae-si, KR;
Yong-Ho Baek, Seoul, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 3/40 (2006.01); H05K 3/28 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4697 (2013.01); H05K 3/4007 (2013.01); H05K 1/113 (2013.01); H05K 3/282 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09472 (2013.01);
Abstract
A printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside, and a dam disposed between the bonding pad and an inner wall of the cavity.