The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Jan. 19, 2017
Applicant:
Xerox Corporation, Norwalk, CT (US);
Inventors:
Chad David Freitag, West Linn, OR (US);
Tygh James Newton, Sherwood, OR (US);
Chad Johan Slenes, Sherwood, OR (US);
Assignee:
XEROX CORPORATION, Norwalk, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/36 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 1/112 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H05K 3/321 (2013.01); H05K 3/361 (2013.01); H05K 3/363 (2013.01); H05K 2201/0394 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09681 (2013.01);
Abstract
A method of forming an electrical interconnect includes etching a lattice pattern into a contact pad on a circuit substrate as a first connection point, at least partially filling the lattice pattern with a conductive epoxy, contacting the conductive epoxy with a second connection point, and curing the epoxy.