The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Dec. 07, 2017
Applicant:
Uniflex Technology Inc., Taichung, TW;
Inventors:
Assignee:
UNIFLEX Technology Inc., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H01L 21/48 (2006.01); C23F 1/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/002 (2013.01); C23F 1/00 (2013.01); H01L 21/486 (2013.01); H05K 3/42 (2013.01); H05K 3/421 (2013.01); H05K 2203/0776 (2013.01);
Abstract
A manufacturing method of a substrate structure including vias includes the following steps. A substrate is provided, wherein a material of the substrate includes polyimide. An etching stop layer is formed on the substrate, wherein the etching stop layer covers two opposite surfaces of the substrate. A patterned process is performed on the etching stop layer to form a plurality of openings exposing a part of the substrate. An etching process is performed on the substrate to remove the part of the substrate exposed by the openings and form a plurality of vias.