The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Nov. 29, 2017
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Takashi Numagi, Hachioji, JP;

Youhei Tazawa, Yokohama, JP;

Shoji Matsumoto, Fujisawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01L 23/48 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01L 23/48 (2013.01); H05K 1/0218 (2013.01); H01L 2224/16225 (2013.01); H05K 1/0216 (2013.01); H05K 2201/09318 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09627 (2013.01);
Abstract

Provided is a printed wiring board including: a plurality of inner layers including a ground layer and a power supply layer; and a plurality of ground vias and a plurality of power supply vias each provided to penetrate at least the ground layer and the power supply layer in a thickness direction of the printed wiring board, a ground potential being applied to the plurality of ground vias at the ground layer, and a power supply potential being applied to the plurality of power supply vias at the power supply layer. In a top view from a direction perpendicular to the printed wiring board, a distance between vias to which the same potential is applied is shorter than a distance between vias to which different potentials are applied.


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