IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10306444 B1

PDFFull Text
Date of Patent:
May. 28, 2019

Filed:

Oct. 27, 2014

Device pairing with a dual use piezoelectric acoustic component and vibration sensor

Applicant:

Ascensia Diabetes Care Holdings Ag, Basel, CH;

Inventors:

Igor Y. Gofman, Croton-on-Hudson, NY (US);

Christopher A. Dionisio, Millington, NJ (US);

Assignee:

Ascensia Diabetes Care Holdings AG, Basel, CH;

Attorney:

Dugan & Dugan, PC

Primary Examiner:

Xin Jia

Int. Cl.
CPC ...
H04B 7/00 (2006.01); H04W 4/80 (2018.01); H04W 76/10 (2018.01); H04L 29/06 (2006.01); H04W 4/20 (2018.01); H04W 4/02 (2018.01); H04W 4/60 (2018.01); G06F 3/01 (2006.01); H04M 1/725 (2006.01); H04W 12/08 (2009.01); A61B 5/00 (2006.01); A61B 5/145 (2006.01); H04W 48/10 (2009.01); H04L 29/08 (2006.01); H04W 4/06 (2009.01); H04W 84/18 (2009.01); H04W 8/00 (2009.01); H04W 48/16 (2009.01); H04W 74/00 (2009.01);
U.S. Cl.
CPC ...
H04W 4/80 (2018.02); A61B 5/002 (2013.01); A61B 5/14532 (2013.01); G06F 3/016 (2013.01); H04L 63/0869 (2013.01); H04L 63/0876 (2013.01); H04L 63/107 (2013.01); H04M 1/7253 (2013.01); H04W 4/023 (2013.01); H04W 4/027 (2013.01); H04W 4/20 (2013.01); H04W 4/60 (2018.02); H04W 12/08 (2013.01); H04W 48/10 (2013.01); H04W 76/10 (2018.02); H04L 67/16 (2013.01); H04M 2201/18 (2013.01); H04M 2201/26 (2013.01); H04M 2250/02 (2013.01); H04M 2250/22 (2013.01); H04W 4/06 (2013.01); H04W 8/005 (2013.01); H04W 48/16 (2013.01); H04W 74/002 (2013.01); H04W 84/18 (2013.01);
Abstract

Some embodiments of the present invention include placing a smart device and a peripheral device in pairing mode; detecting at least one pairing motion event with a dual use piezo circuit within the peripheral device; transmitting an indication of the occurrence of the at least one pairing motion event to the smart device; receiving in the smart device the indication of the occurrence of the at least one pairing motion event in satisfaction of at least one pairing condition; and pairing the smart device with the peripheral device in response to satisfaction of the at least one pairing condition. Numerous other aspects are provided.

Find Patent Forward Citations

Loading…