The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Apr. 20, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Maki Hasegawa, Tokyo, JP;
Takuya Shiraishi, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02P 27/00 (2006.01); H02P 27/06 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01); H01L 25/16 (2006.01); H02M 7/5387 (2007.01); H02P 3/24 (2006.01); H02M 7/00 (2006.01); H01L 23/00 (2006.01); H02M 1/32 (2007.01); H02M 1/42 (2007.01); H02P 3/22 (2006.01);
U.S. Cl.
CPC ...
H02P 27/06 (2013.01); H01L 23/5386 (2013.01); H01L 25/072 (2013.01); H01L 25/16 (2013.01); H02M 7/003 (2013.01); H02M 7/5387 (2013.01); H02P 3/24 (2013.01); H01L 24/48 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/1425 (2013.01); H01L 2924/1426 (2013.01); H02M 1/32 (2013.01); H02M 2001/4291 (2013.01); H02P 3/22 (2013.01); Y02B 70/126 (2013.01);
Abstract
A semiconductor module includes a die pad area between positions where a plurality of power terminals are arranged and positions where an HVIC and an LVIC are arranged. A plurality of RC-IGBTs are arranged in the die pad area at positions closer to the plurality of power terminals than to the HVIC and the LVIC.