The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Apr. 26, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Yasuhiko Kitamura, Tokyo, JP;

Hiroaki Takahashi, Tokyo, JP;

Shozo Kanzaki, Tokyo, JP;

Toshiyuki Yasutomi, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H02M 7/00 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01G 9/15 (2006.01); H01G 11/04 (2013.01); H01G 9/26 (2006.01); H01G 11/10 (2013.01); H01G 9/028 (2006.01); H01G 9/045 (2006.01); H01G 11/30 (2013.01); H01G 11/78 (2013.01); H05K 1/02 (2006.01); H01G 11/18 (2013.01); H01G 9/00 (2006.01); H02M 1/14 (2006.01); H02P 27/06 (2006.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); H01G 9/0003 (2013.01); H01G 9/028 (2013.01); H01G 9/045 (2013.01); H01G 9/15 (2013.01); H01G 9/26 (2013.01); H01G 11/04 (2013.01); H01G 11/10 (2013.01); H01G 11/18 (2013.01); H01G 11/30 (2013.01); H01G 11/78 (2013.01); H02M 1/14 (2013.01); H02P 27/06 (2013.01); H05K 1/0203 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H02M 7/5387 (2013.01); H05K 2201/066 (2013.01); H05K 2201/1009 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10522 (2013.01);
Abstract

To downsize a power smoothing capacitor substrate unit for opening/closing modules configured to convert a low-voltage DC power to AC power to drive a three-phase AC motor. A plurality of unit capacitors () being a conductive polymer aluminum electrolytic capacitor are connected between a positive-side first conductive plate (P) connected to a positive-side power supply terminal (P) and a negative-side second conductive plate (N) connected to a negative-side power supply terminal (N), and three or more capacitor rows are arranged for each of three pairs of divided power supply terminal blocks (B) connected to the opening/closing modules (B) and one or more capacitor rows are arranged between the terminal blocks. Accordingly, ripple currents in a large number of capacitors connected in parallel to each other are equalized to prevent a temperature increase in each capacitor.


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