The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Apr. 17, 2012
Applicants:

Christoph Degen, Toenisvorst, DE;

Bernhard Reul, Herzogenrath, DE;

Mitja Rateiczak, Wuerselen, DE;

Andreas Schlarb, Wuppertal, DE;

Lothar Lesmeister, Landgraaf, NL;

Inventors:

Christoph Degen, Toenisvorst, DE;

Bernhard Reul, Herzogenrath, DE;

Mitja Rateiczak, Wuerselen, DE;

Andreas Schlarb, Wuppertal, DE;

Lothar Lesmeister, Landgraaf, NL;

Assignee:

SAINT-GOBAIN GLASS FRANCE, Courbevoie, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/02 (2006.01); H01R 43/02 (2006.01); H05B 3/84 (2006.01); H01R 13/03 (2006.01); B23K 1/00 (2006.01); B23K 1/002 (2006.01); B23K 1/005 (2006.01); B23K 1/012 (2006.01); B23K 1/06 (2006.01); B23K 33/00 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H01R 4/02 (2006.01); B23K 101/00 (2006.01); B23K 101/38 (2006.01); B23K 103/04 (2006.01); B23K 103/12 (2006.01); H01R 12/57 (2011.01); H01R 101/00 (2006.01);
U.S. Cl.
CPC ...
H01R 43/0235 (2013.01); B23K 1/002 (2013.01); B23K 1/0004 (2013.01); B23K 1/0056 (2013.01); B23K 1/012 (2013.01); B23K 1/06 (2013.01); B23K 33/00 (2013.01); H01R 13/03 (2013.01); H05B 3/84 (2013.01); B23K 2101/006 (2018.08); B23K 2101/38 (2018.08); B23K 2103/05 (2018.08); B23K 2103/12 (2018.08); H01R 4/02 (2013.01); H01R 4/023 (2013.01); H01R 4/029 (2013.01); H01R 12/57 (2013.01); H01R 43/0207 (2013.01); H01R 43/0242 (2013.01); H01R 2101/00 (2013.01); H05B 2203/016 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); Y10T 29/49213 (2015.01);
Abstract

A pane provided with at least one electrical connection element is described. The pane has a substrate, an electroconductive structure on a region of the substrate, a layer of soldering mass on a region of the electroconductive structure, and a connection element on the solder mass. The connection element contains a first and a second base region, a first and a second transition region, and a bridge region between the first and the second transition region, a first and a second contact surface arranged on a lower side of the first and second base regions. The first and the second contact surfaces and surfaces of the first and the second transition regions, facing the substrate are connected to the electroconductive structure by the solder mass. An angle between a surface of the substrate and each tangential plane of the surfaces of the first and the second transition region, facing the substrate, is less than 90°.


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